AM3517/05 is a high-performance ARM Cortex-A8 microprocessor with speeds up to 600 MHz. The device offers 3D graphics acceleration while also supporting numerous peripherals, including DDR2, CAN, EMAC, and USB OTG PHY that are well suited for industrial apllications.

The processor can support other applications, including: Single-board computers Home and industrial automation Human machine Interface

The device supports high-level operating systems (OSs), such as:

• Linux^®
• Windows^® CE
• Android™

The following subsystems are part of the device:

• Microprocessor unit (MPU) subsystem based on the ARM Cortex-A8 microprocessor
• PowerVR SGX graphics accelerator (AM3517 device only) subsystem for 3D graphics acceleration to support display and gaming effects
• Display subsystem with several features for multiple concurrent image manipulation, and a programmable interface supporting a wide variety of displays. The display subsystem also supports NTSC/PAL video out.
• High-performance interconnects provide high-bandwidth data transfers for multiple initiators to the internal and external memory controllers and to on-chip peripherals. The device also offers a comprehensive clock-management scheme.

AM3517/05 devices are available in a 491-pin BGA package and a 484-pin PBGA package.

This AM3517/05 data manual presents the electrical and mechanical specifications for the AM3517/05 Sitara processor.

• AM3517/05 Sitara Processor:
  • MPU Subsystem
    • 600-MHz Sitara ARM Cortex-A8 Core
    • NEON SIMD Coprocessor and Vector Floating-Point (FP) Coprocessor
  • Memory Interfaces:
    • 166-MHz 16- and 32-Bit mDDR/DDR2 Interface with 1GB of Total Addressable Space
    • Up to 83 MHz General-Purpose Memory Interface Supporting 16-Bit-Wide Multiplexed Address/DataBus
    • 64KB of SRAM
    • 3 Removable Media Interfaces [MMC/SD/SDIO]
  • IO Voltage:
    • mDDR/DDR2 IOs: 1.8V
    • Other IOs: 1.8V and 3.3V
  • Core Voltage: 1.2V
  • Commercial and Extended Temperature Grade (operating restrictions apply)
  • 16-Bit Video Input Port Capable of Capturing HD Video
  • HD Resolution Display Subsystem
  • Serial Communication
    • High-End CAN Controller
    • 10/100 Mbit Ethernet MAC
    • USB OTG Subsystem with Standard DP/DM Interface [HS/FS/LS]
    • Multiport USB Host Subsystem [HS/FS/LS]
      • 12-Pin ULPI or 6-, 4-, or 3-Pin Serial Interface
    • Four Master and Slave Multichannel Serial Port Interface(McSPI) Ports
    • Five Multichannel Buffered Serial Ports (McBSPs)
      • 512-Byte Transmit and Receive Buffer (McBSP1/3/4/5)
      • 5-KB Transmit and Receive Buffer (McBSP2)
      • SIDETONE Core Support (McBSP2 and McBSP3 Only)For Filter, Gain, and Mix Operations
      • 128-Channel Transmit and Receive Mode
      • Direct Interface to I2S and PCM Device and TDM Buses
    • HDQ/1-Wire Interface
    • 4 UARTs (One with Infrared Data Association [IrDA] and Consumer Infrared [CIR] Modes)
    • 3 Master and Slave High-Speed Inter-Integrated Circuit (I2C) Controllers
    • Twelve 32-bit General-Purpose Timers
    • One 32-bit Watchdog Timer
    • One 32-bit 32-kHz Sync Timer
    • Up to 186 General-Purpose I/O (GPIO) Pins
• Display Subsystem
  • Parallel Digital Output
  • Up to 24-Bit RGB
  • Supports Up to 2 LCD Panels
  • Support for Remote Frame Buffer Interface (RFBI) LCD Panels
  • Two 10-Bit Digital-to-Analog Converters (DACs) Supporting
    • Composite NTSC/PAL Video
    • Luma/Chroma Separate Video (S-Video)
  • Rotation of 90, 180, and 270 Degrees
  • Resize Images From 1/4x to 8x
  • Color Space Converter
  • 8-Bit Alpha Blending
• Video Processing Front End (VPFE) 16-Bit Video Input Port
  • RAW Data Interface
  • 75-MHz Maximum Pixel Clock
  • Supports REC656/CCIR656 Standard
  • Supports YCbCr422 Format (8-Bit or 16-Bit with Discrete Horizontal and Vertical Sync Signals)
  • Generates Optical Black Clamping Signals
  • Built-in Digital Clamping and Black Level Compensation
  • 10-Bit to 8-Bit A-law Compression Hardware
  • Supports up to 16K Pixels (Image Size) in Horizontal and Vertical Directions
• System Direct Memory Access (sDMA) Controller (32 Logical Channels with Configurable Priority)
• Comprehensive Power, Reset, and Clock Management
• ARM Cortex-A8 Memory Architecture
  • ARMv7 Architecture
  • In-Order, Dual-Issue, Superscalar Microprocessor Core
  • ARM NEON Multimedia Architecture
  • Over 2x Performance of ARMv6 SIMD
  • Supports Both Integer and Floating-Point SIMD
  • Jazelle RCT Execution Environment Architecture
  • Dynamic Branch Prediction with Branch Target Address Cache, Global History Buffer and 8-Entry Return Stack
  • Embedded Trace Macrocell [ETM] Support for Noninvasive Debug
  • 16KB of Instruction Cache (4-Way Set-Associative)
  • 16KB of Data Cache (4-Way Set-Associative)
  • 256KB of L2 Cache
• PowerVR SGX Graphics Accelerator (AM3517 Only)
  • Tile-Based Architecture Delivering up to 10 MPoly/sec
  • Universal Scalable Shader Engine: Multi-threaded Engine Incorporating Pixel and Vertex Shader Functionality
  • Industry Standard API Support: OpenGLES 1.1 and 2.0, OpenVG1.0
  • Fine-Grained Task Switching, Load Balancing, and Power Management
  • Programmable, High-Quality Image Anti-Aliasing
• Endianess
  • ARM Instructions – Little Endian
  • ARM Data – Configurable
• SDRC Memory Controller
  • 16- and 32-Bit Memory Controller with 1GB of Total Address Space
  • Double Data Rate (DDR2) SDRAM, Mobile Double Data Rate (mDDR)SDRAM
  • SDRAM Memory Scheduler (SMS) and Rotation Engine
• General Purpose Memory Controller (GPMC)
  • 16-Bit-Wide Multiplexed Address/Data Bus
  • Up to 8 Chip-Select Pins with 128MB of Address Space per Chip-Select Pin
  • Glueless Interface to NOR Flash, NAND Flash (with ECC Hamming Code Calculation), SRAM and Pseudo-SRAM
  • Flexible Asynchronous Protocol Control for Interface to Custom Logic (FPGA, CPLD, ASICs, and so forth)
  • Nonmultiplexed Address/Data Mode (Limited 2-KB Address Space)
• Test Interfaces
  • IEEE-1149.1 (JTAG) Boundary-Scan Compatible
  • Embedded Trace Macro Interface (ETM)
• 65-nm CMOS Technology
• Packages:
  • 491-Pin BGA (17 x 17, 0.65-mm Pitch) [ZCN Suffix] with Via Channel Array Technology
  • 484-Pin PBGA (23 x 23, 1-mm Pitch) [ZER Suffix]

• Arm CPU
• 1 Arm Cortex-A8
• Arm MHz (Max.)
• 600
• CPU
• 32-bit
• Graphics acceleration
• 1 3D
• Display type
• 1 LCD
• Protocols
• Ethernet
• Ethernet MAC
• 1-Port 10/100
• Hardware accelerators
• Image/Video Extension
• Operating system
• Linux, RTOS
• Security
• Cryptography
• Rating
• Catalog
• Operating temperature range (C)
• -40 to 105, 0 to 90

AM3505的完整型号有：AM3505AZCN、AM3505AZCNA、AM3505AZCNAC、AM3505AZCNC、AM3505AZER、AM3505AZERA，以下是这些产品的关键参数及官网采购报价：

AM3505AZCN，工作温度：0 to 90，封装：NFBGA (ZCN)-491，包装数量MPQ：90个，MSL 等级/回流焊峰值温度：Level-3-260C-168 HR，引脚镀层/焊球材料：SNAGCU，TI官网AM3505AZCN的批量USD价格：14.025（1000+）

AM3505AZCNA，工作温度：-40 to 105，封装：NFBGA (ZCN)-491，包装数量MPQ：90个，MSL 等级/回流焊峰值温度：Level-3-260C-168 HR，引脚镀层/焊球材料：SNAGCU，TI官网AM3505AZCNA的批量USD价格：16.83（1000+）

AM3505AZCNAC，工作温度：-40 to 105，封装：NFBGA (ZCN)-491，包装数量MPQ：90个，MSL 等级/回流焊峰值温度：Level-3-260C-168 HR，引脚镀层/焊球材料：SNAGCU，TI官网AM3505AZCNAC的批量USD价格：16.83（1000+）

AM3505AZCNC，工作温度：0 to 90，封装：NFBGA (ZCN)-491，包装数量MPQ：90个，MSL 等级/回流焊峰值温度：Level-3-260C-168 HR，引脚镀层/焊球材料：SNAGCU，TI官网AM3505AZCNC的批量USD价格：14.025（1000+）

AM3505AZER，工作温度：0 to 90，封装：BGA (ZER)-484，包装数量MPQ：60个，MSL 等级/回流焊峰值温度：Level-3-260C-168 HR，引脚镀层/焊球材料：SNAGCU，TI官网AM3505AZER的批量USD价格：14.025（1000+）

AM3505AZERA，工作温度：-40 to 105，封装：BGA (ZER)-484，包装数量MPQ：60个，MSL 等级/回流焊峰值温度：Level-3-260C-168 HR，引脚镀层/焊球材料：SNAGCU，TI官网AM3505AZERA的批量USD价格：16.83（1000+）

TMDSEMU200-U — Spectrum Digital XDS200 USB 仿真器

Spectrum Digital XDS200 是最新 XDS200 系列 TI 处理器调试探针（仿真器）的首个模型。XDS200 系列拥有超低成本 XDS100 与高性能 XDS560v2 之间的低成本与高性能的完美平衡。此外，对于带有嵌入式缓冲跟踪器 (ETB) 的所有 ARM 和 DSP 处理器，所有 XDS 调试探针均支持内核和系统跟踪。

Spectrum Digital XDS200 通过 TI 20 引脚连接器（带有适合 TI 14 引脚、TI 10 引脚和 ARM 20 引脚的多个适配器）连接到目标板，而通过 USB2.0 高速连接 (480Mbps) 连接到主机 PC。要在主机 (...)

TMDSEMU560V2STM-U — Blackhawk XDS560v2 系统跟踪 USB 仿真器

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XDS560v2 System Trace 在其巨大的外部存储器缓冲区中加入了系统引脚跟踪。这种外部存储器缓冲区适用于指定的 TI 器件，通过捕获相关器件级信息，获得准确的总线性能活动和吞吐量，并对内核和外设进行电源管理。此外，对于带有嵌入式缓冲跟踪器 (ETB) 的所有 ARM 和 DSP 处理器，所有 XDS (...)

TMDSEMU560V2STM-UE — Spectrum Digital XDS560v2 系统跟踪 USB 和以太网

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XDS560v2 System Trace 在其巨大的外部存储器缓冲区中加入了系统引脚跟踪。这种外部存储器缓冲区适用于指定的 TI 器件，通过捕获相关器件级信息，获得准确的总线性能活动和吞吐量，并对内核和外设进行电源管理。此外，对于带有嵌入式缓冲跟踪器 (ETB) 的所有 ARM 和 DSP 处理器，所有 XDS (...)

LINUXEZSDK-AM35X — 用于 AM3517 和 AM3505 的 Linux EZ SDK

虽然起初专为移动手持终端而设计，Android 操作系统仍允许嵌入式应用的设计人员轻松为产品增加高级操作系统。与 Google 联合开发的 Android 是一套可立即实现集成和生产的全面操作系统。

Android 操作系统的亮点在于：

• 完整的开放源码软件解决方案
• 基于 Linux
• 针对商业开发的简洁许可条款 (Apache)
• 包含一个完整的应用框架
• 允许通过 Java 轻松集成定制开发应用
• 开包即用的多媒体、图形和图形用户界面
• 大量 Android 和应用开发人员供随时调遣

DEMOAPP-AM35X — 演示 - AM35x 应用示例和演示代码

Free Example Code - TI provides proof-of-concept application code to demonstrate some of the hardware and software capabilities of its devices.

• Click GET SOFTWARE to access Application Demo and Documentation, based on the AM35x EVM (evaluation module).

WIND-3P-VXWORKS-LINUX-OS — Wind River 处理器 VxWorks 和 Linux 操作系统

Wind River 是提供物联网 (IoT) 软件的全球领导者。自 1981 年以来，该公司的技术一直在为全世界最安全的器件提供支持，现在已广泛应用于超过 20 亿产品中。Wind River 提供全面的边缘到云产品系列，并针对这些产品提供世界一流的全球专业服务和备受赞誉的客户支持。Wind River 的 VxWorks 和 Linux 产品支持各种 TI 处理器。

如需了解有关 Wind River 的更多信息，请访问 https://www.windriver.com。

发件人： Wind River Systems

CCSTUDIO-SITARA — 适用于 Sitara™ 处理器的 Code Composer Studio (CCS) 集成开发环境 (IDE)

Code Composer Studio™ - Integrated Development Environment for Sitara™ ARM© Processors

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MG-3P-NUCLEUS-RTOS — Mentor Graphics Nucleus RTOS

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QNX-3P-NEUTRINO-RTOS — QNX Neutrino RTOS

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AM35x ZCN IBIS Model (Rev. A)

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POWEREST — 功耗估算工具 (PET)

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PROCESSORS-3P-SEARCH — Arm-based MPU, arm-based MCU and DSP third-party search tool

TI has partnered with companies to offer a wide range of software, tools, and SOMs using TI processors to accelerate your path to production. Download this search tool to quickly browse our third-party solutions and find the right third-party to meet your needs. The software, tools and modules (...)