The CC2540 is a cost-effective, low-power, true system-on-chip (SoC) for Bluetooth low energy applications. It enables robust BLE master or slave nodes to be built with very low total bill-of-material costs. The CC2540 combines an excellent RF transceiver with an industry-standard enhanced 8051 MCU, in-system programmable flash memory, 8-KB RAM, and many other powerful supporting features and peripherals. The CC2540 is suitable for systems where very low power consumption is required. Very low-power sleep modes are available. Short transition times between operating modes further enable low power consumption.

The CC2540 comes in two different versions: CC2540F128/F256, with 128 and 256 KB of flash memory, respectively.

Combined with the Bluetooth low energy protocol stack from Texas Instruments, the CC2540F128/F256 forms the market’s most flexible and cost-effective single-mode Bluetooth low energy solution.

• True Single-Chip BLE Solution: CC2540 Can Run Both Application and BLE Protocol Stack, Includes Peripherals to Interface With Wide Range of Sensors, Etc.
• 6-mm × 6-mm Package
• RF
  • Bluetooth low energy technology Compatible
  • Excellent Link Budget (up to 97 dB), Enabling Long-Range Applications Without External Front End
  • Accurate Digital Received Signal-Strength Indicator (RSSI)
  • Suitable for Systems Targeting Compliance With Worldwide Radio Frequency Regulations: ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47 Part 15 (US), and ARIB STD-T66 (Japan)
• Layout
  • Few External Components
  • Reference Design Provided
  • 6-mm × 6-mm QFN40 Package
• Low Power
  • Active Mode RX Down to 19.6 mA
  • Active Mode TX (6 dBm): 24 mA
  • Power Mode 1 (3-s Wake-Up): 235 A
  • Power Mode 2 (Sleep Timer On): 0.9 A
  • Power Mode 3 (External Interrupts): 0.4 A
  • Wide Supply Voltage Range (2 V3.6 V)
  • Full RAM and Register Retention in All Power Modes
• TPS62730 Compatible Low Power in Active Mode
  • RX Down to 15.8 mA (3 V Supply)
  • TX (-6 dBm): 18.6 mA (3 V Supply)
• Microcontroller
  • High-Performance and Low-Power 8051 Microcontroller Core
  • In-System-Programmable Flash, 128 KB or 256 KB
  • 8-KB SRAM
• Peripherals
  • 12-Bit ADC with Eight Channels and Configurable Resolution
  • Integrated High-Performance Op-Amp and Ultralow-Power Comparator
  • General-Purpose Timers (One 16-Bit, Two 8-Bit)
  • 21 General-Purpose I/O Pins (19× 4 mA, 2× 20 mA)
  • 32-kHz Sleep Timer With Capture
  • Two Powerful USARTs With Support for Several Serial Protocols
  • Full-Speed USB Interface
  • IR Generation Circuitry
  • Powerful Five-Channel DMA
  • AES Security Coprocessor
  • Battery Monitor and Temperature Sensor
  • Each CC2540 Contains a Unique 48-bit IEEE Address
• Software Features
  • Bluetooth v4.0 Compliant Protocol Stack for Single-Mode BLE Solution
    • Complete Power-Optimized Stack, Including Controller and Host
      • GAP Central, Peripheral, Observer, or Broadcaster (Including Combination Roles)
      • ATT / GATT Client and Server
      • SMP AES-128 Encryption and Decryption
      • L2CAP
    • Sample Applications and Profiles
      • Generic Applications for GAP Central and Peripheral Roles
      • Proximity, Accelerometer, Simple Keys, and Battery GATT Services
    • Multiple Configuration options
      • Single-Chip Configuration, Allowing Application to Run on CC2540
      • Network Processor Interface for Applications Running on an External Microcontroller
    • BTool Windows PC Application for Evaluation, Development, and Test
  • Development Tools
    • CC2540 Mini Development Kit
    • SmartRF Software
    • Supported by IAR Embedded Workbench Software for 8051

APPLICATIONS

• 2.4-GHz Bluetooth low energy Systems
• Mobile Phone Accessories
• Sports and Leisure Equipment
• Consumer Electronics
• Human Interface Devices (Keyboard, Mouse, Remote Control)
• USB Dongles
• Health Care and Medical

CC2540 with TPS62730

• TPS62730 is a 2 MHz Step Down Converter with Bypass Mode
• Extends Battery Lifetime by up to 20%
• Reduced Current in TX and RX
• 30 nA Bypass Mode Current to Support Low Power Modes
• RF Performance Unchanged
• Small Package Allows for Small Solution Size
• CC2540 Controllable

All other trademarks are the property of their respective owners

• Protocols
• Bluetooth Low Energy 5.0
• Type
• Wireless MCU
• Features
• LE 1M PHY
• Peripherals
• 1 comparator, 12-bit ADC 8-channel, 2 SPI, 2 UART, 4 timers, USB
• Rating
• Catalog
• RAM (KB)
• 8
• GPIO
• 21
• Security
• Cryptographic acceleration, Debug security, Device identity, Software IP protection
• Sensitivity (best) (dBm)
• -93
• Operating temperature range (C)
• -40 to 85

CC2540的完整型号有：CC2540F128RHAR、CC2540F128RHAT、CC2540F256RHAR、CC2540F256RHAT，以下是这些产品的关键参数及官网采购报价：

CC2540F128RHAR，工作温度：-40 to 85，封装：VQFN (RHA)-40，包装数量MPQ：2500个，MSL 等级/回流焊峰值温度：Level-3-260C-168 HR，引脚镀层/焊球材料：NIPDAUAG，TI官网CC2540F128RHAR的批量USD价格：1.91（1000+）

CC2540F128RHAT，工作温度：-40 to 85，封装：VQFN (RHA)-40，包装数量MPQ：250个，MSL 等级/回流焊峰值温度：Level-3-260C-168 HR，引脚镀层/焊球材料：NIPDAU，TI官网CC2540F128RHAT的批量USD价格：2.292（1000+）

CC2540F256RHAR，工作温度：-40 to 85，封装：VQFN (RHA)-40，包装数量MPQ：2500个，MSL 等级/回流焊峰值温度：Level-3-260C-168 HR，引脚镀层/焊球材料：NIPDAU，TI官网CC2540F256RHAR的批量USD价格：1.96（1000+）

CC2540F256RHAT，工作温度：-40 to 85，封装：VQFN (RHA)-40，包装数量MPQ：250个，MSL 等级/回流焊峰值温度：Level-3-260C-168 HR，引脚镀层/焊球材料：NIPDAU，TI官网CC2540F256RHAT的批量USD价格：2.342（1000+）

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