This device is a digitally controlled analog switch that utilizes silicon-gate CMOS technology to achieve operating speeds similar to LSTTL, with the low power consumption of standard CMOS integrated circuits.

This analog multiplexer/demultiplexer controls analog voltages that may vary across the voltage supply range (i.e., V_CC to V_EE). It is a bidirectional switch that allows any analog input to be used as an output and vice-versa. The switch has low ON resistance and low OFF leakages. In addition, this device has an enable control that, when high, disables all switches to their OFF state.

• Qualified for Automotive Applications
• Wide Analog Input Voltage Range: ±5 V Max
• Low ON Resistance
  • 70 Typical (VCC VEE = 4.5 V)
  • 40 Typical (VCC VEE = 9 V)
• Low Crosstalk Between Switches
• Fast Switching and Propagation Speeds
• Break-Before-Make Switching
• Wide Operating Temperature Range: 40°C to 125°C
• Operation Control Voltage: 4.5 V to 5.5 V
• Switch Voltage: 0 V to 10 V
• Direct LSTTL Input Logic Compatibility: VIL = 0.8 V Max, VIH = 2 V Min
• CMOS Input Compatibility: II ≤ 1 A at VOL, VOH

• Configuration
• 8:1
• Number of channels (#)
• 1
• Power supply voltage - single (V)
• 5
• Protocols
• Analog
• Ron (Typ) (Ohms)
• 40
• CON (Typ) (pF)
• 25
• ON-state leakage current (Max) (A)
• 2
• Bandwidth (MHz)
• 180
• Operating temperature range (C)
• -40 to 125
• Features
• Break-before-make
• Input/output continuous current (Max) (mA)
• 25
• Rating
• Automotive
• Supply current (Typ) (uA)
• 8

CD74HCT4051-Q1的完整型号有：CD74HCT4051QM96Q1、D24051QM96G4Q1，以下是这些产品的关键参数及官网采购报价：

CD74HCT4051QM96Q1，工作温度：-40 to 125，封装：SOIC (D)-16，包装数量MPQ：2500个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网CD74HCT4051QM96Q1的批量USD价格：.148（1000+）

D24051QM96G4Q1，工作温度：-40 to 125，封装：SOIC (D)-16，包装数量MPQ：2500个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网D24051QM96G4Q1的批量USD价格：.168（1000+）

LEADED-ADAPTER1 用于快速测试 TI 5、8、10、16 和 24 引脚引线式封装的表面贴装转 DIP 接头适配器

EVM-LEADED1 板可对 TI 的常见引线式封装进行快速测试和电路板试验。该评估板具有足够的空间，可将 TI 的 D、DBQ、DCT、DCU、DDF、DGS、DGV 和 PW 表面贴装封装转换为 100mil DIP 接头。