These programmable array logic devices feature high speed and a choice of either standard or half-power devices. They combine Advanced Low-Power Schottky technology with proven titanium-tungsten fuses. These devices will provide reliable, high-performance substitutes for conventional TTL logic. Their easy programmability allow for quick design of "custom" functions and typically results in a more compact circuit board. In addition, chip carriers are available for further reduction in board space.

The Half-Power versions offer a choice of operating frequency, switching speeds, and power dissipation. In many cases, these Half-Power devices can result in significant power reduction from an overall system level.

The PAL16' M series is characterized for operation over the full military temperature range of -55°C to 125°C.

• Choice of Operating Speeds
  • High-Speed, A Devices . . . 25 MHz Min
  • Half-Power, A-2 Devices . . . 16 MHz Min
• Choice of Input/Output Configuration
• Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package
DEVICE I INPUTS 3-STATE O OUTPUTS REGISTERED Q OUTPUTS I/O PORT S PAL16L8 10 2 0 6 PAL16R4 8 0 4 (3-state buffers) 4 PAL16R6 8 0 6 (3-state buffers) 2 PAL16R8 8 0 8 (3-state buffers) 0

PAL is a registered trademark of Advanced Micro Devices Inc.

• Supply voltage (Min) (V)
• 4.5
• Supply voltage (Max) (V)
• 5.5
• Clock Frequency (Max) (MHz)
• 25
• ICC (Max) (uA)
• 180000
• Rating
• Military
• Operating temperature range (C)
• -55 to 125

PAL16R8AM的完整型号有：81036082A、8103608RA、PAL16R8AMFKB、PAL16R8AMJ、PAL16R8AMJB，以下是这些产品的关键参数及官网采购报价：

81036082A，工作温度：-55 to 125，封装：LCCC (FK)-20，包装数量MPQ：1个，MSL 等级/回流焊峰值温度：N/A for Pkg Type，引脚镀层/焊球材料：SNPB，TI官网81036082A的批量USD价格：34.255（1000+）

8103608RA，工作温度：-55 to 125，封装：CDIP (J)-20，包装数量MPQ：1个，MSL 等级/回流焊峰值温度：N/A for Pkg Type，引脚镀层/焊球材料：SNPB，TI官网8103608RA的批量USD价格：26.858（1000+）

PAL16R8AMFKB，工作温度：-55 to 125，封装：LCCC (FK)-20，包装数量MPQ：1个，MSL 等级/回流焊峰值温度：N/A for Pkg Type，引脚镀层/焊球材料：SNPB，TI官网PAL16R8AMFKB的批量USD价格：34.255（1000+）

PAL16R8AMJ，工作温度：-55 to 125，封装：CDIP (J)-20，包装数量MPQ：1个，MSL 等级/回流焊峰值温度：N/A for Pkg Type，引脚镀层/焊球材料：SNPB，TI官网PAL16R8AMJ的批量USD价格：20.255（1000+）

PAL16R8AMJB，工作温度：-55 to 125，封装：CDIP (J)-20，包装数量MPQ：1个，MSL 等级/回流焊峰值温度：N/A for Pkg Type，引脚镀层/焊球材料：SNPB，TI官网PAL16R8AMJB的批量USD价格：26.858（1000+）