
- 制造厂商:TI(德州仪器,Texas Instruments)
- 产品类别:逻辑和电压转换
- 技术类目:缓冲器、驱动器和收发器 - 同相缓冲器和驱动器
- 功能描述:具有 TTL 兼容型 CMOS 输入和三态输出的 8 通道、4.5V 至 5.5V 缓冲器
- 点击这里打开及下载SN74ABT2244A的技术文档资料
- TI代理渠道,提供当日发货、严格的质量标准,满足您的目标价格

These octal buffers and line drivers are designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. Together with the SN54ABT2240, SN74ABT2240A, and 'ABT2241, these devices provide the choice of selected combinations of inverting and noninverting outputs, symmetrical active-low output-enable (OE\) inputs, and complementary OE and OE\ inputs. These devices feature high fan-out and improved fan-in.
The outputs, which are designed to sink up to 12 mA, include equivalent 25- series resistors to reduce overshoot and undershoot.
When VCC is between 0 and 2.1 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 2.1 V, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
The SN54ABT2244A is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ABT2244A is characterized for operation from -40°C to 85°C.
- Output Ports Have Equivalent 25- Series Resistors, So No External Resistors Are Required
- ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
- Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
- State-of-the-Art EPIC-II BTM BiCMOS Design Significantly Reduces Power Dissipation
- Typical VOLP (Output Ground Bounce) < 1 V at VCC = 5 V, TA = 25°C
- High-Impedance State During Power Up and Power Down
- Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, Ceramic Chip Carriers (FK), Plastic (N) and Ceramic (J) DIPs, and Ceramic Flat (W) Packages
EPIC-IIB is a trademark of Texas Instruments Incorporated.
- Technology Family
- ABT
- Supply voltage (Min) (V)
- 4.5
- Supply voltage (Max) (V)
- 5.5
- Number of channels (#)
- 8
- IOL (Max) (mA)
- 12
- ICC (Max) (uA)
- 30000
- IOH (Max) (mA)
- -32
- Input type
- TTL-Compatible CMOS
- Output type
- 3-State
- Features
- Ultra high speed (tpd <5ns), Partial power down (Ioff), Over-voltage tolerant inputs, Power up 3-state, Damping resistors
- Rating
- Catalog
SN74ABT2244A的完整型号有:SN74ABT2244ADBR、SN74ABT2244ADW、SN74ABT2244ADWR、SN74ABT2244AN、SN74ABT2244ANSR、SN74ABT2244APW、SN74ABT2244APWR,以下是这些产品的关键参数及官网采购报价:
SN74ABT2244ADBR,工作温度:-40 to 85,封装:SSOP (DB)-20,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74ABT2244ADBR的批量USD价格:.31(1000+)
SN74ABT2244ADW,工作温度:-40 to 85,封装:SOIC (DW)-20,包装数量MPQ:25个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74ABT2244ADW的批量USD价格:.338(1000+)
SN74ABT2244ADWR,工作温度:-40 to 85,封装:SOIC (DW)-20,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74ABT2244ADWR的批量USD价格:.282(1000+)
SN74ABT2244AN,工作温度:-40 to 85,封装:PDIP (N)-20,包装数量MPQ:20个,MSL 等级/回流焊峰值温度:N/A for Pkg Type,引脚镀层/焊球材料:NIPDAU,TI官网SN74ABT2244AN的批量USD价格:.324(1000+)
SN74ABT2244ANSR,工作温度:-40 to 85,封装:SO (NS)-20,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74ABT2244ANSR的批量USD价格:.31(1000+)
SN74ABT2244APW,工作温度:-40 to 85,封装:TSSOP (PW)-20,包装数量MPQ:70个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74ABT2244APW的批量USD价格:.338(1000+)
SN74ABT2244APWR,工作温度:-40 to 85,封装:TSSOP (PW)-20,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74ABT2244APWR的批量USD价格:.282(1000+)

14-24-LOGIC-EVM 支持 14 到 24 引脚 PW、DB、D、DW、NS、DYY 和 DGV 封装的通用逻辑 EVM
该 EVM 设计用于支持采用 14 至 24 引脚 D、DW、DB、NS、PW、DYY 或 DGV 封装的任何逻辑器件。





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