
- 制造厂商:TI(德州仪器,Texas Instruments)
- 产品类别:逻辑和电压转换
- 技术类目:触发器、锁存器和寄存器 - D 型触发器
- 功能描述:具有三态输出的八路边沿触发式 D 型触发器
- 点击这里打开及下载SN74AHC574的技术文档资料
- TI代理渠道,提供当日发货、严格的质量标准,满足您的目标价格

The SNx4AHC574 devices are octal edge-triggered D-type flip-flops that feature 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. These devices are particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.
- Operating Range 2-V to 5.5-V VCC
- 3-State Outputs Drive Bus Lines Directly
- Latch-Up Performance Exceeds 250 mA Per JESD 17
- On Products Compliant to MIL-PRF-38535, All Parameters Are Tested Unless Otherwise Noted. On All Other Products, Production Processing Does Not Necessarily Include Testing of All Parameters.
- ESD Protection Exceeds JESD 22
- 2000-V Human-Body Model
- 200-V Machine Model
- 1000-V Charged-Device Model
- Number of channels (#)
- 8
- Technology Family
- AHC
- Supply voltage (Min) (V)
- 2
- Supply voltage (Max) (V)
- 5.5
- Input type
- Standard CMOS
- Output type
- 3-State
- Clock Frequency (Max) (MHz)
- 110
- IOL (Max) (mA)
- 8
- IOH (Max) (mA)
- -8
- ICC (Max) (uA)
- 40
- Features
- Balanced outputs, High speed (tpd 10-50ns), Over-voltage tolerant inputs
SN74AHC574的完整型号有:SN74AHC574DBR、SN74AHC574DGVR、SN74AHC574DW、SN74AHC574DWR、SN74AHC574N、SN74AHC574NSR、SN74AHC574PW、SN74AHC574PWR,以下是这些产品的关键参数及官网采购报价:
SN74AHC574DBR,工作温度:-40 to 125,封装:SSOP (DB)-20,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74AHC574DBR的批量USD价格:.14(1000+)
SN74AHC574DGVR,工作温度:-40 to 125,封装:TVSOP (DGV)-20,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74AHC574DGVR的批量USD价格:.127(1000+)
SN74AHC574DW,工作温度:-40 to 125,封装:SOIC (DW)-20,包装数量MPQ:25个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74AHC574DW的批量USD价格:.374(1000+)
SN74AHC574DWR,工作温度:-40 to 125,封装:SOIC (DW)-20,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74AHC574DWR的批量USD价格:.14(1000+)
SN74AHC574N,工作温度:-40 to 125,封装:PDIP (N)-20,包装数量MPQ:20个,MSL 等级/回流焊峰值温度:N/A for Pkg Type,引脚镀层/焊球材料:NIPDAU,TI官网SN74AHC574N的批量USD价格:.2(1000+)
SN74AHC574NSR,工作温度:-40 to 125,封装:SO (NS)-20,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74AHC574NSR的批量USD价格:.191(1000+)
SN74AHC574PW,工作温度:-40 to 125,封装:TSSOP (PW)-20,包装数量MPQ:70个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74AHC574PW的批量USD价格:.374(1000+)
SN74AHC574PWR,工作温度:-40 to 125,封装:TSSOP (PW)-20,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74AHC574PWR的批量USD价格:.119(1000+)

14-24-LOGIC-EVM 支持 14 到 24 引脚 PW、DB、D、DW、NS、DYY 和 DGV 封装的通用逻辑 EVM
该 EVM 设计用于支持采用 14 至 24 引脚 D、DW、DB、NS、PW、DYY 或 DGV 封装的任何逻辑器件。








- ONET8551T
- TPS65178
- ADS5444-SP
- UCC25600
- TLC5916-Q1
- DS96F175MQML
- SN74LVTH16374
- BQ25050
- DS90UH925Q-Q1
- SN74ALVTH16821
- TPS60151
- SN65LBC180A
- UC2706M
- TLC2274
- CD54HC112
- TPSM53602
- SN54LS243
- MSP430F2013-EP
- LM4673
- PGA202
- ADS8517IDW
- THS1230CDWR
- BQ25015EVM
- PCM56P-J
- CLC001AJE
- CD40147BNSRE4
- UCC28514DWR
- TPS2062D
- LM2937ESX-3.3
- LMC6462AMN
- UCC27424DGN
- TMDSCNCD28335
- TPS23882RTQT
- TPS37AB7806FDSKRQ1
- CC115LRTKT
- LM2636MX/NOPB
- CD74HCT40105E
- LM3444MA/NOPB
- OPA338UAG4
- BUF04701AIPWRG4

