This dual buffer/driver is operational at 0.8-V to 2.7-V V_CC, but is designed specifically for 1.65-V to 1.95-V V_CC operation.

The output of the SN74AUC2G07 is open drain and can be connected to other open-drain outputs to implement active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using I_off. The I_off circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

• Available in the Texas Instruments NanoFree Package
• Optimized for 1.8-V Operation and Is 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
• Ioff Supports Partial-Power-Down Mode Operation
• Sub-1-V Operable
• Max tpd of 2.5 ns at 1.8 V
• Low Power Consumption, 10 A at 1.8 V
• ±8-mA Output Drive at 1.8 V
• Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
• ESD Protection Exceeds JESD 22
  • 2000-V Human-Body Model (A114-A)
  • 200-V Machine Model (A115-A)
  • 1000-V Charged-Device Model (C101)

NanoFree is a trademark of Texas Instruments.

• Technology Family
• AUC
• Supply voltage (Min) (V)
• 0.8
• Supply voltage (Max) (V)
• 2.7
• Number of channels (#)
• 2
• IOL (Max) (mA)
• 9
• ICC (Max) (uA)
• 10
• IOH (Max) (mA)
• 0
• Input type
• Standard CMOS
• Output type
• Open-Drain
• Features
• Ultra high speed (tpd <5ns), Partial power down (Ioff), Over-voltage tolerant inputs
• Rating
• Catalog

SN74AUC2G07的完整型号有：SN74AUC2G07DBVR、SN74AUC2G07DBVT、SN74AUC2G07DCKR、SN74AUC2G07YZPR，以下是这些产品的关键参数及官网采购报价：

SN74AUC2G07DBVR，工作温度：-40 to 85，封装：SOT-23 (DBV)-6，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74AUC2G07DBVR的批量USD价格：.189（1000+）

SN74AUC2G07DBVT，工作温度：-40 to 85，封装：SOT-23 (DBV)-6，包装数量MPQ：250个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74AUC2G07DBVT的批量USD价格：.389（1000+）

SN74AUC2G07DCKR，工作温度：-40 to 85，封装：SC70 (DCK)-6，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74AUC2G07DCKR的批量USD价格：.189（1000+）

SN74AUC2G07YZPR，工作温度：-40 to 85，封装：DSBGA (YZP)-6，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：SNAGCU，TI官网SN74AUC2G07YZPR的批量USD价格：.253（1000+）

5-8-LOGIC-EVM 支持 5 至 8 引脚 DCK、DCT、DCU、DRL 和 DBV 封装的通用逻辑 EVM

灵活的 EVM 设计用于支持具有 5 至 8 引脚数且采用 DCK、DCT、DCU、DRL 或 DBV 封装的任何器件。