The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire V_CC range of 0.8 V to 3.6 V, resulting in increased battery life. This product also maintains excellent signal integrity.

The SN74LVC3G17 contains three buffers and performs the Boolean function Y = A. The device functions as three independent buffers but, because of Schmitt action, it may have different input threshold levels for positive-going (V_T+) and negative-going (V_T–) signals.

NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using I_off. The I_off circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

• Available in the Texas Instruments NanoStar Package
• Low Static-Power Consumption (ICC = 0.9 A Maximum)
• Low Dynamic-Power Consumption (Cpd = 4.3 pF Typ at 3.3 V)
• Low Input Capacitance (Ci = 1.5 pF Typical)
• Low Noise Overshoot and Undershoot <10% of VCC
• Ioff Supports Partial-Power-Down Mode Operation
• Wide Operating VCC Range of 0.8 V to 3.6 V
• Optimized for 3.3-V Operation
• 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
• tpd = 5.1 ns Maximum at 3.3 V
• Suitable for Point-to-Point Applications
• Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
• ESD Performance Tested Per JESD 22
  • 2000-V Human-Body Model (A114-B, Class II)
  • 1000-V Charged-Device Model (C101)

NanoStar Is a trademark of Texas Instruments

• Technology Family
• AUP
• Supply voltage (Min) (V)
• 0.8
• Supply voltage (Max) (V)
• 3.6
• Number of channels (#)
• 3
• IOL (Max) (mA)
• 4
• ICC (Max) (uA)
• 0.9
• IOH (Max) (mA)
• -4
• Input type
• Schmitt-Trigger
• Output type
• Push-Pull
• Features
• Balanced outputs, Very high speed (tpd 5-10ns), Partial power down (Ioff), Over-voltage tolerant inputs
• Rating
• Catalog

SN74AUP3G17的完整型号有：SN74AUP3G17DCUR、SN74AUP3G17DQER、SN74AUP3G17RSER、SN74AUP3G17YFPR，以下是这些产品的关键参数及官网采购报价：

SN74AUP3G17DCUR，工作温度：-40 to 85，封装：VSSOP (DCU)-8，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74AUP3G17DCUR的批量USD价格：.244（1000+）

SN74AUP3G17DQER，工作温度：-40 to 85，封装：X2SON (DQE)-8，包装数量MPQ：5000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAUAG，TI官网SN74AUP3G17DQER的批量USD价格：.256（1000+）

SN74AUP3G17RSER，工作温度：-40 to 85，封装：UQFN (RSE)-8，包装数量MPQ：5000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAUAG，TI官网SN74AUP3G17RSER的批量USD价格：.317（1000+）

SN74AUP3G17YFPR，工作温度：-40 to 85，封装：DSBGA (YFP)-8，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：SNAGCU，TI官网SN74AUP3G17YFPR的批量USD价格：.294（1000+）

5-8-LOGIC-EVM 支持 5 至 8 引脚 DCK、DCT、DCU、DRL 和 DBV 封装的通用逻辑 EVM

灵活的 EVM 设计用于支持具有 5 至 8 引脚数且采用 DCK、DCT、DCU、DRL 或 DBV 封装的任何器件。