The SN74CBTS3384 provides ten bits of high-speed TTL-compatible bus switching with Schottky diodes on the I/Os to clamp undershoot. The low on-state resistance of the switch allows connections to be made with minimal propagation delay.

The device is organized as two 5-bit bus switches with separate output-enable (OE\) inputs. When OE\ is low, the switch is on, and port A is connected to port B. When OE\ is high, the switch is open, and the high-impedance state exists between the two ports.

• 5- Switch Connection Between Two Ports
• TTL-Compatible Input Levels

• Configuration
• 1:1 SPST
• Number of channels (#)
• 10
• Power supply voltage - single (V)
• 5
• Protocols
• Analog
• Ron (Typ) (Ohms)
• 5
• ON-state leakage current (Max) (A)
• 150
• Bandwidth (MHz)
• 200
• Operating temperature range (C)
• -40 to 85
• Features
• Undershoot protection
• Input/output continuous current (Max) (mA)
• 128
• Rating
• Catalog

SN74CBTS3384的完整型号有：SN74CBTS3384PW、SN74CBTS3384PWR，以下是这些产品的关键参数及官网采购报价：

SN74CBTS3384PW，工作温度：-40 to 85，封装：TSSOP (PW)-24，包装数量MPQ：60个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74CBTS3384PW的批量USD价格：.248（1000+）

SN74CBTS3384PWR，工作温度：-40 to 85，封装：TSSOP (PW)-24，包装数量MPQ：2000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74CBTS3384PWR的批量USD价格：.207（1000+）

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EVM-LEADED1 板可对 TI 的常见引线式封装进行快速测试和电路板试验。该评估板具有足够的空间，可将 TI 的 D、DBQ、DCT、DCU、DDF、DGS、DGV 和 PW 表面贴装封装转换为 100mil DIP 接头。