
- 制造厂商:TI(德州仪器,Texas Instruments)
- 产品类别:开关与多路复用器
- 技术类目:模拟开关和多路复用器
- 功能描述:汽车类 5.5V、1:1 (SPST)、单通道模拟开关
- 点击这里打开及下载SN74LVC1G66-Q1的技术文档资料
- TI代理渠道,提供当日发货、严格的质量标准,满足您的目标价格

This single analog switch is designed for 1.65-V to 5.5-V VCC operation.
The SN74LVC1G66-Q1 device supports analog and digital signals. The device permits bidirectional transmission of signals with amplitudes of up to 5.5 V (peak).
- Qualified for Automotive Applications
- AEC-Q100 Qualified With the Following Results:
- Device Temperature Grade 1: 40°C to 125°C Ambient Operating Temperature Range
- Device HBM Classification Level H2
- Device CDM Classification Level C5
- Device MM Classification Level M3
- 1.65-V to 5.5-V VCC Operation
- Inputs Accept Voltages to 5.5 V
- Max tpd of 0.8 ns at 3.3 V
- High On-Off Output Voltage Ratio
- High Degree of Linearity
- High Speed, Typically 0.5 ns (VCC = 3 V, CL = 50 pF)
- Low ON-State Resistance, Typically ≠5.5 Ω (VCC = 4.5 V)
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- Configuration
- 1:1 SPST
- Number of channels (#)
- 1
- Power supply voltage - single (V)
- 1.8, 2.5, 3.3, 5
- Protocols
- Analog
- Ron (Typ) (Ohms)
- 7.5
- CON (Typ) (pF)
- 13
- ON-state leakage current (Max) (A)
- 1
- Bandwidth (MHz)
- 300
- Operating temperature range (C)
- -40 to 125
- Input/output continuous current (Max) (mA)
- 50
- Rating
- Automotive
- Supply current (Typ) (uA)
- 1
SN74LVC1G66-Q1的完整型号有:1P1G66QDBVRG4Q1、1P1G66QDBVRQ1、SN74LVC1G66QDCKRQ1,以下是这些产品的关键参数及官网采购报价:
1P1G66QDBVRG4Q1,工作温度:-40 to 125,封装:SOT-23 (DBV)-5,包装数量MPQ:3000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网1P1G66QDBVRG4Q1的批量USD价格:.113(1000+)
1P1G66QDBVRQ1,工作温度:-40 to 125,封装:SOT-23 (DBV)-5,包装数量MPQ:3000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网1P1G66QDBVRQ1的批量USD价格:.101(1000+)
SN74LVC1G66QDCKRQ1,工作温度:-40 to 125,封装:SC70 (DCK)-5,包装数量MPQ:3000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74LVC1G66QDCKRQ1的批量USD价格:.101(1000+)

DIP-ADAPTER-EVM DIP 适配器评估模块
借助 DIP-Adapter-EVM 加快运算放大器的原型设计和测试,该 EVM 有助于快速轻松地连接小型表面贴装 IC 并且价格低廉。您可以使用随附的 Samtec 端子板连接任何受支持的运算放大器,或者将这些端子板直接连接至现有电路。
DIP-Adapter-EVM 套件支持六种常用的业界通用封装,包括:
- D 和 U (SOIC-8)
- PW (TSSOP-8)
- DGK(MSOP-8、VSSOP-8)
- DBV(SOT23-6、SOT23-5 和 SOT23-3)
- DCK(SC70-6 和 SC70-5)
- DRL (SOT563-6)




- SN54LVTH244A-SP
- LM3671
- SN74LV573A
- TLC2543
- TMS570LS3137
- BQ25050
- SN74LVTH374-EP
- ADC34J22
- SN74LVTH16541
- TS3DS26227
- SN74LVC1G3208
- PGA450-Q1
- THS4061
- SN74LVC16245A
- TLV320AIC3106-Q1
- TPS62810-Q1
- SN54S11
- TLV2771-Q1
- SN54LS26-SP
- TPS65265
- TPA2000D1TPWRQ1
- MAX3232EIDBG4
- SN75276D
- TLV70015DSET
- PCM1821Q1EVM
- PCM1739EG4
- SN74CBT16209ADLR
- LMX2531LQ1415E/NOPB
- MSP430FR2033IG56R
- SN74LS423D
- UA78L05CLPR
- MSP430F2234IRHAT
- LMG3522R050RQSR
- TLC2252ID
- TPS62350YZGR
- UC2842ADWTR
- ADC081S051CISD/NOPB
- TPS3106K33DBVR
- UCD3020ARGZR
- ADC0809CCN/NOPB

