The SN74LVC3G34 device is a triple buffer gate designed for 1.65-V to 5.5-V V_CC operation. The SN74LVC3G34 device performs the Boolean function Y = A in positive logic.

NanoFree package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using I_off. The I_off circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

• Available in the Texas Instruments NanoFree Package
• Supports 5.5-V VCC Operation
• Inputs Accept Voltages to 5.5 V
• Max tpd of 4.1 ns at 3.3 V
• Low Power Consumption, 10-A Maximum ICC
• ±24-mA Output Drive at 3.3 V
• Typical VOLP (Output Ground Bounce) <0.8 V at VCC = 3.3 V, TA = 25°C
• Typical VOHV (Output VOH Undershoot) >2 V at VCC = 3.3 V, TA = 25°C
• Ioff Supports Live Insertion, Partial-Power-Down Mode, and Back-Drive Protection
• Can Be Used as a Down Translator to Translate Inputs From a Maximum of 5.5 V Down to the VCC Level
• Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
• ESD Protection Exceeds JESD 22
  • 2000-V Human Body Model (A114-A)
  • 200-V Machine Model (A115-A)
  • 1000-V Charged-Device Model (C101)

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• Technology Family
• LVC
• Supply voltage (Min) (V)
• 1.65
• Supply voltage (Max) (V)
• 5.5
• Number of channels (#)
• 3
• IOL (Max) (mA)
• 32
• ICC (Max) (uA)
• 10
• IOH (Max) (mA)
• -32
• Input type
• Standard CMOS
• Output type
• Push-Pull
• Features
• Balanced outputs, Very high speed (tpd 5-10ns), Partial power down (Ioff), Over-voltage tolerant inputs
• Rating
• Catalog

SN74LVC3G34的完整型号有：SN74LVC3G34DCTR、SN74LVC3G34DCUR、SN74LVC3G34DCURG4、SN74LVC3G34DCUT、SN74LVC3G34DCUTG4、SN74LVC3G34YZPR，以下是这些产品的关键参数及官网采购报价：

SN74LVC3G34DCTR，工作温度：-40 to 125，封装：SM8 (DCT)-8，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74LVC3G34DCTR的批量USD价格：0.132（1000+）

SN74LVC3G34DCUR，工作温度：-40 to 125，封装：VSSOP (DCU)-8，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：SN，TI官网SN74LVC3G34DCUR的批量USD价格：0.172（1000+）

SN74LVC3G34DCURG4，工作温度：-40 to 125，封装：VSSOP (DCU)-8，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74LVC3G34DCURG4的批量USD价格：0.245（1000+）

SN74LVC3G34DCUT，工作温度：-40 to 125，封装：VSSOP (DCU)-8，包装数量MPQ：250个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：SN，TI官网SN74LVC3G34DCUT的批量USD价格：0.256（1000+）

SN74LVC3G34DCUTG4，工作温度：-40 to 125，封装：VSSOP (DCU)-8，包装数量MPQ：250个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74LVC3G34DCUTG4的批量USD价格：0.288（1000+）

SN74LVC3G34YZPR，工作温度：-40 to 85，封装：DSBGA (YZP)-8，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：SNAGCU，TI官网SN74LVC3G34YZPR的批量USD价格：0.273（1000+）

5-8-LOGIC-EVM 支持 5 至 8 引脚 DCK、DCT、DCU、DRL 和 DBV 封装的通用逻辑 EVM

灵活的 EVM 设计用于支持具有 5 至 8 引脚数且采用 DCK、DCT、DCU、DRL 或 DBV 封装的任何器件。