The 'LVT162240 devices are 16-bit buffers/drivers designed specifically for low-voltage (3.3-V) V_CC operation and to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. They have the capability to provide a TTL interface to a 5-V system environment.

These devices can be used as four 4-bit buffers, two 8-bit buffers, or one 16-bit buffer and provide inverting outputs and symmetrical active-low output-enable (OE) inputs.

The outputs, which are designed to source or sink up to 12 mA, include equivalent 22- series resistors to reduce overshoot and undershoot.

When V_CC, is between 0 and 1.5 V, the devices are in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.5 V, OE should be tied to V_CC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

These devices are fully specified for hot-insertion applications using I_off and power-up 3-state. The I_off circuitry disables the outputs, preventing damaging current backflow through the devices when they are powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict.

The SN54LVT162240 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74LVT162240 is characterized for operation from -40°C to 85°C.

• Members of the Texas Instruments Widebus? Family
• State-of-the-Art Advanced BiCMOS Technology (ABT) Design for 3.3-V Operation and Low Static-Power Dissipation
• Output Ports Have Equivalent 22- Series Resistors, So No External Resistors Are Required
• Support Mixed-Mode Signal Operation (5-V Input and Output Voltages With 3.3-V VCC)
• Support Unregulated Battery Operation Down to 2.7 V
• Typical VOLP (Output Ground Bounce) <0.8 V at VCC = 3.3 V, TA = 25°C
• Ioff and Power-Up 3-State Support Hot Insertion
• Distributed VCC and GND Pins Minimize High-Speed Switching Noise
• Flow-Through Architecture Optimizes PCB Layout
• Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
• ESD Protection Exceeds JESD 22
  • 2000-V Human-Body Model (A114-A)
  • 200-V Machine Model (A115-A)
  • 1000-V Charged-Device Model (C101)
• Package Options Include Plastic Shrink Small-Outline (DL), Thin Shrink Small-Outline (DGG), and Thin Very Small-Outline (DGV) Packages and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center Spacings

Widebus is a trademark of Texas Instruments.

• Technology Family
• LVT
• Supply voltage (Min) (V)
• 2.7
• Supply voltage (Max) (V)
• 3.6
• Number of channels (#)
• 16
• IOL (Max) (mA)
• 12
• IOH (Max) (mA)
• -12
• ICC (Max) (uA)
• 5000
• Input type
• TTL-Compatible CMOS
• Output type
• 3-State
• Features
• Balanced outputs, Ultra high speed (tpd <5ns), Partial power down (Ioff), Over-voltage tolerant inputs, Power up 3-state, Damping resistors
• Rating
• Catalog

SN74LVT162240的完整型号有：SN74LVT162240DGGR、SN74LVT162240DGVR、SN74LVT162240DL，以下是这些产品的关键参数及官网采购报价：

SN74LVT162240DGGR，工作温度：-40 to 85，封装：TSSOP (DGG)-48，包装数量MPQ：2000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74LVT162240DGGR的批量USD价格：.683（1000+）

SN74LVT162240DGVR，工作温度：-40 to 85，封装：TVSOP (DGV)-48，包装数量MPQ：2000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74LVT162240DGVR的批量USD价格：.683（1000+）

SN74LVT162240DL，工作温度：-40 to 85，封装：SSOP (DL)-48，包装数量MPQ：25个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74LVT162240DL的批量USD价格：.888（1000+）

SN74LVT162240DGGR，工作温度：-40 to 85，封装：TSSOP (DGG)-48，包装数量MPQ：2000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74LVT162240DGGR的批量USD价格：.683（1000+）

SN74LVT162240DGVR，工作温度：-40 to 85，封装：TVSOP (DGV)-48，包装数量MPQ：2000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74LVT162240DGVR的批量USD价格：.683（1000+）

SN74LVT162240DL，工作温度：-40 to 85，封装：SSOP (DL)-48，包装数量MPQ：25个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74LVT162240DL的批量USD价格：.888（1000+）