These octal buffers/drivers are designed specifically for low-voltage (3.3-V) V_CC operation with the capability to provide a TTL interface to a 5-V system environment.

These devices are organized as two 4-bit line drivers with separate output-enable () inputs. When is low, the device passes data from the A inputs to the Y outputs. When is high, the outputs are in the high-impedance state.

Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.

The SN74LVTZ244 is available in TI's shrink small-outline package (DB), which provides the same I/O pin count and functionality of standard small-outline packages in less than half the printed-circuit-board area.

The SN54LVTZ244 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74LVTZ244 is characterized for operation from -40°C to 85°C.

• State-of-the-Art Advanced BiCMOS Technology (ABT) Design for 3.3-V Operation and Low-Static Power Dissipation
• High-Impedance State During Power Up and Power Down
• Support Mixed-Mode Signal Operation (5-V Input and Output Voltages With 3.3-V VCC)
• Support Unregulated Battery Operation Down to 2.7 V
• Typical VOLP (Output Ground Bounce)< 0.8 V at VCC = 3.3 V, TA = 25°C
• Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
• Bus-Hold Data Inputs Eliminate the Need for External Pullup Resistors
• Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, Ceramic Chip Carriers (FK), and Ceramic (J) DIPs

• Technology Family
• LVT
• Supply voltage (Min) (V)
• 2.7
• Supply voltage (Max) (V)
• 3.6
• Number of channels (#)
• 8
• IOL (Max) (mA)
• 64
• ICC (Max) (uA)
• 15000
• IOH (Max) (mA)
• -32
• Input type
• TTL-Compatible CMOS
• Output type
• 3-State
• Features
• Ultra high speed (tpd <5ns), Partial power down (Ioff), Over-voltage tolerant inputs, Power up 3-state, Bus-hold
• Rating
• Catalog

SN74LVTZ244的完整型号有：SN74LVTZ244DBR、SN74LVTZ244DW、SN74LVTZ244DWR、SN74LVTZ244PWR，以下是这些产品的关键参数及官网采购报价：

SN74LVTZ244DBR，工作温度：-40 to 85，封装：SSOP (DB)-20，包装数量MPQ：2000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74LVTZ244DBR的批量USD价格：.301（1000+）

SN74LVTZ244DW，工作温度：-40 to 85，封装：SOIC (DW)-20，包装数量MPQ：25个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74LVTZ244DW的批量USD价格：.328（1000+）

SN74LVTZ244DWR，工作温度：-40 to 85，封装：SOIC (DW)-20，包装数量MPQ：2000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74LVTZ244DWR的批量USD价格：.274（1000+）

SN74LVTZ244PWR，工作温度：-40 to 85，封装：TSSOP (PW)-20，包装数量MPQ：2000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74LVTZ244PWR的批量USD价格：.274（1000+）

14-24-LOGIC-EVM — 支持 14 到 24 引脚 PW、DB、D、DW、NS、DYY 和 DGV 封装的通用逻辑 EVM

该 EVM 设计用于支持采用 14 至 24 引脚 D、DW、DB、NS、PW、DYY 或 DGV 封装的任何逻辑器件。