These programmable array logic devices feature high speed and functional equivalency when compared with currently available devices. These IMPACT™ circuits combine the latest Advanced Low-Power Schottky technology with proven titanium-tungsten fuses to provide reliable, high-performance substitutes for conventional TTL logic. Their easy programmability allows for quick design of custom functions and typically results in a more compact circuit board. In addition, chip carriers are available for further reduction in board space.

The TIBPAL16’ C series is characterized from 0°C to 75°C. The TIBPAL16’ M series is characterized for operation over the full military temperature range of –55°C to 125°C.

• High-Performance Operation: Propagation Delay C Suffix . . . 25 ns Max M Suffix . . . 30 ns Max
• Functionally Equivalent, but Faster Than PAL16L8A, PAL16R4A, PAL16R6A, and PAL16R8A
• Power-Up Clear on Registered Devices (All Register Outputs Are Set High, but Voltage Levels at the Output Pins Go Low)
• Package Options Include Both Plastic and Ceramic Chip Carriers in Addition to Plastic and Ceramic DIPs
• Dependable Texas Instruments Quality and Reliability

IMPACT is a trademark of Texas Instruments. PAL is a registered trademark of Advanced Micro Devices Inc.

• Supply voltage (Min) (V)
• 4.75
• Supply voltage (Max) (V)
• 5.25
• Clock Frequency (Max) (MHz)
• 30
• ICC (Max) (uA)
• 100000
• Rating
• Military
• Operating temperature range (C)
• -55 to 125

TIBPAL16R6-30M的完整型号有：5962-85155072A、5962-8515507RA、TIBPAL16R6-30MFKB、TIBPAL16R6-30MJ、TIBPAL16R6-30MJB，以下是这些产品的关键参数及官网采购报价：

5962-85155072A，工作温度：-55 to 125，封装：LCCC (FK)-20，包装数量MPQ：1个，MSL 等级/回流焊峰值温度：N/A for Pkg Type，引脚镀层/焊球材料：SNPB，TI官网5962-85155072A的批量USD价格：24.952（1000+）

5962-8515507RA，工作温度：-55 to 125，封装：CDIP (J)-20，包装数量MPQ：1个，MSL 等级/回流焊峰值温度：N/A for Pkg Type，引脚镀层/焊球材料：SNPB，TI官网5962-8515507RA的批量USD价格：17.254（1000+）

TIBPAL16R6-30MFKB，工作温度：-55 to 125，封装：LCCC (FK)-20，包装数量MPQ：1个，MSL 等级/回流焊峰值温度：N/A for Pkg Type，引脚镀层/焊球材料：SNPB，TI官网TIBPAL16R6-30MFKB的批量USD价格：24.952（1000+）

TIBPAL16R6-30MJ，工作温度：-55 to 125，封装：CDIP (J)-20，包装数量MPQ：1个，MSL 等级/回流焊峰值温度：N/A for Pkg Type，引脚镀层/焊球材料：SNPB，TI官网TIBPAL16R6-30MJ的批量USD价格：16.182（1000+）

TIBPAL16R6-30MJB，工作温度：-55 to 125，封装：CDIP (J)-20，包装数量MPQ：1个，MSL 等级/回流焊峰值温度：N/A for Pkg Type，引脚镀层/焊球材料：SNPB，TI官网TIBPAL16R6-30MJB的批量USD价格：17.254（1000+）