
- 制造厂商:TI(德州仪器,Texas Instruments)
- 产品类别:逻辑和电压转换
- 技术类目:缓冲器、驱动器和收发器 - 通用收发器
- 功能描述:具有三态输出的 9 位总线收发器
- 点击这里打开及下载SN74ABT863的技术文档资料
- TI代理渠道,提供当日发货、严格的质量标准,满足您的目标价格

The 'ABT863 devices are 9-bit transceivers designed for asynchronous communication between data buses. The control-function implementation allows for maximum flexibility in timing.
These devices allow noninverted data transmission from the A bus to the B bus or from the B bus to the A bus, depending on the logic levels at the output-enable (OEAB\ and OEBA\) inputs.
The outputs are in the high-impedance state during power up and power down. The outputs remain in the high-impedance state while the device is powered down.
When VCC is between 0 and 2.1 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 2.1 V, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
The SN54ABT863 is characterized for operation over the full military temperature range of -55°C to 125°C.
The SN74ABT863 is characterized for operation from -40°C to 85°C.
- State-of-the-Art EPIC-II BTM BiCMOS Design Significantly Reduces Power Dissipation
- Typical VOLP (Output Ground Bounce) < 1 V at VCC = 5 V, TA = 25°C
- High-Impedance State During Power Up and Power Down
- High-Drive Outputs (-32-mA IOH, 64-mA IOL)
- Latch-Up Performance Exceeds 500 mA Per JESD 17
- ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
- Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB) Packages, and Thin Shrink Small-Outline (PW), Ceramic Chip Carriers (FK), Plastic (NT), and Ceramic (JT) DIPs
EPIC-IIB is a trademark of Texas Instruments Incorporated.
- IOL (Max) (mA)
- 64
- IOH (Max) (mA)
- -32
- Technology Family
- ABT
- Rating
- Catalog
- Operating temperature range (C)
- -40 to 85
SN74ABT863的完整型号有:SN74ABT863DW、SN74ABT863DWR,以下是这些产品的关键参数及官网采购报价:
SN74ABT863DW,工作温度:-40 to 85,封装:SOIC (DW)-24,包装数量MPQ:25个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74ABT863DW的批量USD价格:1.109(1000+)
SN74ABT863DWR,工作温度:-40 to 85,封装:SOIC (DW)-24,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74ABT863DWR的批量USD价格:0.924(1000+)

14-24-LOGIC-EVM 支持 14 到 24 引脚 PW、DB、D、DW、NS、DYY 和 DGV 封装的通用逻辑 EVM
该 EVM 设计用于支持采用 14 至 24 引脚 D、DW、DB、NS、PW、DYY 或 DGV 封装的任何逻辑器件。


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