- 制造厂商：TI
- 产品类别：逻辑和电压转换
- 技术类目：专用逻辑 IC - 数字多路信号分离器和解码器
- 功能描述：2 选 1 解码器/多路复用器
- 点击这里打开及下载SN74AUC1G19的技术文档资料
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This 1-of-2 decoder/demultiplexer is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to 1.95-V VCC operation.
The SN74AUC1G19 is a 1-of-2 decoder/demultiplexer. This device buffers the data on input A and passes it to the outputs Y0 (true) and Y1 (complement) when the enable (E) input signal is low.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
For more information about AUC Little Logic devices, see Applications of Texas Instruments AUC Sub-1-V Little Logic Devices, SCEA027.
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Protection Exceeds JESD 22
- 2000-V Human-Body Model (A114-A)
- 200-V Machine Model (A115-A)
- 1000-V Charged-Device Model (C101)
- Available in the Texas Instruments NanoFree? Package
- Optimized for 1.8-V Operation and Is 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
- Ioff Supports Partial-Power-Down Mode Operation
- Sub-1-V Operable
- ±8-mA Output Drive at 1.8 V VCC
- Maximum tpd of 3 ns at 1.8 V
- Low Power Consumption, 10-μA Maximum ICC
- Technology Family
- AUC
- Number of channels (#)
- 1
- Operating temperature range (C)
- -40 to 85
- Rating
- Catalog
- ICC (Max) (uA)
- 10
SN74AUC1G19的完整型号有：SN74AUC1G19DBVR、SN74AUC1G19DCKR、SN74AUC1G19DCKT、SN74AUC1G19DRLR、SN74AUC1G19YZPR，以下是这些产品的关键参数及官网采购报价：
SN74AUC1G19DBVR，工作温度：-40 to 85，封装：SOT-23 (DBV)-6，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74AUC1G19DBVR的批量USD价格：.106（1000+）
SN74AUC1G19DCKR，工作温度：-40 to 85，封装：SC70 (DCK)-6，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74AUC1G19DCKR的批量USD价格：.106（1000+）
SN74AUC1G19DCKT，工作温度：-40 to 85，封装：SC70 (DCK)-6，包装数量MPQ：250个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74AUC1G19DCKT的批量USD价格：.306（1000+）
SN74AUC1G19DRLR，工作温度：-40 to 85，封装：SOT-5X3 (DRL)-6，包装数量MPQ：4000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74AUC1G19DRLR的批量USD价格：.131（1000+）
SN74AUC1G19YZPR，工作温度：-40 to 85，封装：DSBGA (YZP)-6，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：SNAGCU，TI官网SN74AUC1G19YZPR的批量USD价格：.17（1000+）
5-8-LOGIC-EVM — 支持 5 至 8 引脚 DCK、DCT、DCU、DRL 和 DBV 封装的通用逻辑 EVM
灵活的 EVM 设计用于支持具有 5 至 8 引脚数且采用 DCK、DCT、DCU、DRL 或 DBV 封装的任何器件。
