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SN74CBT3125C的基本参数
  • 制造厂商:TI
  • 产品类别:开关与多路复用器
  • 技术类目:模拟开关和多路复用器
  • 功能描述:具有 –2V 下冲保护的 5V、1:1 (SPST)、4 通道 FET 总线开关
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SN74CBT3125C的产品详情:

The SN74CBT3125C is a high-speed TTL-compatible FET bus switch with low ON-state resistance (ron), allowing for minimal propagation delay. Active Undershoot-Protection Circuitry on the A and B ports of the SN74CBT3125C provides protection for undershoot up to –2 V by sensing an undershoot event and ensuring that the switch remains in the proper OFF state.

The SN74CBT3125C is organized as four 1-bit bus switches with separate output-enable (1OE\, 2OE\, 3OE\, 4OE\) inputs. It can be used as four 1-bit bus switches or as one 4-bit bus switch. When OE\ is low, the associated 1-bit bus switch is ON, and the A port is connected to the B port, allowing bidirectional data flow between ports. When OE\ is high, the associated 1-bit bus switch is OFF, and the high-impedance state exists between the A and B ports.

This device is fully specified for partial-power-down applications using Ioff. The Ioff feature ensures that damaging current will not backflow through the device when it is powered down.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

SN74CBT3125C的优势和特性:
  • Undershoot Protection for Off-Isolation on A and B Ports Up To –2 V
  • Bidirectional Data Flow, With Near-Zero Propagation Delay
  • Low On-State Resistance (ron) Characteristics (ron = 3 Typical)
  • Low Input/Output Capacitance Minimizes Loading and Signal Distortion (Cio(OFF) = 5 pF Typical)
  • Data and Control Inputs Provide Undershoot Clamp Diodes
  • Low Power Consumption (ICC = 3 μA Max)
  • VCC Operating Range From 4 V to 5.5 V
  • Data I/Os Support 0 to 5-V Signaling Levels (0.8-V, 1.2-V, 1.5-V, 1.8-V, 2.5-V, 3.3-V, 5-V)
  • Control Inputs Can Be Driven by TTL or 5-V/3.3-V CMOS Outputs
  • Ioff Supports Partial-Power-Down Mode Operation
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • Supports Both Digital and Analog Applications: USB Interface, Bus Isolation, Low-Distortion Signal Gating

SN74CBT3125C的参数(英文):
  • Configuration
  • 1:1 SPST
  • Number of channels (#)
  • 4
  • Power supply voltage - single (V)
  • 5
  • Protocols
  • Analog, JTAG, UART, I2C, SPI, RGMII, TDM, I2S
  • Ron (Typ) (Ohms)
  • 3
  • CON (Typ) (pF)
  • 12.5
  • ON-state leakage current (Max) (μA)
  • 10
  • Bandwidth (MHz)
  • 200
  • Operating temperature range (C)
  • -40 to 85
  • Features
  • Undershoot protection
  • Input/output continuous current (Max) (mA)
  • 128
  • Rating
  • Catalog
SN74CBT3125C具体的完整产品型号参数及价格(美元):

SN74CBT3125C的完整型号有:SN74CBT3125CD、SN74CBT3125CDBQR、SN74CBT3125CDBR、SN74CBT3125CDR、SN74CBT3125CPW、SN74CBT3125CPWR、SN74CBT3125CRGYR,以下是这些产品的关键参数及官网采购报价:

SN74CBT3125CD,工作温度:-40 to 85,封装:SOIC (D)-14,包装数量MPQ:50个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74CBT3125CD的批量USD价格:.378(1000+)

SN74CBT3125CDBQR,工作温度:-40 to 85,封装:SSOP (DBQ)-16,包装数量MPQ:2500个,MSL 等级/回流焊峰值温度:Level-2-260C-1 YEAR,引脚镀层/焊球材料:NIPDAU,TI官网SN74CBT3125CDBQR的批量USD价格:.205(1000+)

SN74CBT3125CDBR,工作温度:-40 to 85,封装:SSOP (DB)-14,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74CBT3125CDBR的批量USD价格:.205(1000+)

SN74CBT3125CDR,工作温度:-40 to 85,封装:SOIC (D)-14,包装数量MPQ:2500个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74CBT3125CDR的批量USD价格:.178(1000+)

SN74CBT3125CPW,工作温度:-40 to 85,封装:TSSOP (PW)-14,包装数量MPQ:90个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74CBT3125CPW的批量USD价格:.378(1000+)

SN74CBT3125CPWR,工作温度:-40 to 85,封装:TSSOP (PW)-14,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74CBT3125CPWR的批量USD价格:.178(1000+)

SN74CBT3125CRGYR,工作温度:-40 to 85,封装:VQFN (RGY)-14,包装数量MPQ:3000个,MSL 等级/回流焊峰值温度:Level-2-260C-1 YEAR,引脚镀层/焊球材料:NIPDAU,TI官网SN74CBT3125CRGYR的批量USD价格:.205(1000+)

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SN74CBT3125C的评估套件:

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