
- 制造厂商:TI(德州仪器,Texas Instruments)
- 产品类别:音频
- 技术类目:音频放大器 - 耳机放大器
- 功能描述:150mW 立体声模拟输入耳机放大器
- 点击这里打开及下载TPA6111A2的技术文档资料
- TI代理渠道,提供当日发货、严格的质量标准,满足您的目标价格

The TPA6111A2 is a stereo audio power amplifier packaged in either an 8-pin SOIC or an 8-pin PowerPAD MSOP package capable of delivering 150 mW of continuous RMS power per channel into 16-Ω loads. Amplifier gain is externally configured by means of two resistors per input channel and does not require external compensation for settings of 0 to 20 dB.
THD+N, when driving a 16-Ω load from 5 V, is 0.03% at 1 kHz, and less than 1% across the audio band of 20Hz to 20 kHz. For 32-Ω loads, the THD+N is reduced to less than 0.02% at 1 kHz, and is less than 1% across the audio band of 20 Hz to 20 kHz. For 10-kΩ loads, the THD+N performance is 0.005% at 1 kHz, and less than 0.5% across the audio band of 20 Hz to 20 kHz.
- 150-mW Stereo Output
- PC Power Supply Compatible
- Fully Specified for 3.3-V and 5-V Operation
- Operation to 2.5 V
- Pop Reduction Circuitry
- Internal Midrail Generation
- Thermal and Short-Circuit Protection
- Surface-Mount Packaging
- PowerPAD MSOP
- SOIC
- Pin Compatible With TPA122, LM4880, and LM4881 (SOIC)
- Output power (W)
- 0.15
- Analog supply (Min) (V)
- 2.5
- Analog supply (Max) (V)
- 5.5
- PSRR (dB)
- 83
- Rating
- Catalog
- Operating temperature range (C)
- -40 to 85
- Headphone channels
- Stereo
- Volume control
- No
- Shutdown current (ISD) (uA)
- 1
- Architecture
- Class-AB
- Iq per channel (Typ) (mA)
- 0.75
TPA6111A2的完整型号有:TPA6111A2D、TPA6111A2DGN、TPA6111A2DGNR、TPA6111A2DR,以下是这些产品的关键参数及官网采购报价:
TPA6111A2D,工作温度:-40 to 85,封装:SOIC (D)-8,包装数量MPQ:75个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网TPA6111A2D的批量USD价格:0.434(1000+)
TPA6111A2DGN,工作温度:-40 to 85,封装:HVSSOP (DGN)-8,包装数量MPQ:80个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAUAG,TI官网TPA6111A2DGN的批量USD价格:0.534(1000+)
TPA6111A2DGNR,工作温度:-40 to 85,封装:HVSSOP (DGN)-8,包装数量MPQ:2500个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网TPA6111A2DGNR的批量USD价格:0.462(1000+)
TPA6111A2DR,工作温度:-40 to 85,封装:SOIC (D)-8,包装数量MPQ:2500个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网TPA6111A2DR的批量USD价格:0.362(1000+)

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