This dual positive-edge-triggered D-type flip-flop is designed for 1.65-V to 5.5-V V_CC operation.

When data at the data (D) input meets the setup time requirement, the data is transferred to the Q output on the positive-going edge of the clock pulse. Clock triggering occurs at a voltage level and is not directly related to the rise time of the clock pulse. Following the hold-time interval, data at the D input can be changed without affecting the levels at the outputs.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using I_off. The I_off circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

• Available in the Texas Instruments NanoFree Package
• Supports 5-V VCC Operation
• Inputs Accept Voltages to 5.5 V
• Max tpd of 4.2 ns at 3.3 V
• Low Power Consumption, 10-μA Max ICC
• ±24-mA Output Drive at 3.3 V
• Typical VOLP (Output Ground Bounce) <0.8 V at VCC = 3.3 V, TA = 25°C
• Typical VOHV (Output VOH Undershoot) >2 V at VCC = 3.3 V, TA = 25°C
• Ioff Feature Supports Live Insertion, Partial-Power-Down Mode Operation and Back Drive Protection
• Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
• ESD Protection Exceeds JESD 22
  • 2000-V Human-Body Model (A114-A)
  • 200-V Machine Model (A115-A)
  • 1000-V Charged-Device Model (C101)

• Number of channels (#)
• 2
• Technology Family
• LVC
• Supply voltage (Min) (V)
• 1.65
• Supply voltage (Max) (V)
• 5.5
• Input type
• Standard CMOS
• Output type
• Push-Pull
• Clock Frequency (Max) (MHz)
• 150
• IOL (Max) (mA)
• 32
• IOH (Max) (mA)
• -32
• ICC (Max) (uA)
• 5
• Features
• Balanced outputs

SN74LVC2G79的完整型号有：SN74LVC2G79DCTR、SN74LVC2G79DCUR、SN74LVC2G79DCURG4、SN74LVC2G79YZPR，以下是这些产品的关键参数及官网采购报价：

SN74LVC2G79DCTR，工作温度：-40 to 125，封装：SM8 (DCT)-8，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74LVC2G79DCTR的批量USD价格：.183（1000+）

SN74LVC2G79DCUR，工作温度：-40 to 125，封装：VSSOP (DCU)-8，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74LVC2G79DCUR的批量USD价格：.127（1000+）

SN74LVC2G79DCURG4，工作温度：-40 to 125，封装：VSSOP (DCU)-8，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74LVC2G79DCURG4的批量USD价格：.205（1000+）

SN74LVC2G79YZPR，工作温度：-40 to 85，封装：DSBGA (YZP)-8，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：SNAGCU，TI官网SN74LVC2G79YZPR的批量USD价格：.238（1000+）

5-8-LOGIC-EVM 支持 5 至 8 引脚 DCK、DCT、DCU、DRL 和 DBV 封装的通用逻辑 EVM

灵活的 EVM 设计用于支持具有 5 至 8 引脚数且采用 DCK、DCT、DCU、DRL 或 DBV 封装的任何器件。