
- 制造厂商:TI(德州仪器,Texas Instruments)
- 产品类别:电源管理
- 技术类目:栅极驱动器 - 低侧驱动器
- 功能描述:具有反相输入和分离输出的汽车类 9A/9A 单通道栅极驱动器
- 点击这里打开及下载UCC27321-Q1的技术文档资料
- TI代理渠道,提供当日发货、严格的质量标准,满足您的目标价格

The UCC2732x-Q1 family of high-speed drivers delivers 9 A of peak drive current in an industry-standard pinout. These drivers can drive large MOSFETs for systems requiring extreme Miller current due to high dV/dt transitions. This eliminates additional external circuits and can replace multiple components to reduce space, design complexity, and assembly cost. Two standard logic options are offered, inverting (UCC27321-Q1) and noninverting (UCC27322-Q1).
Using a design that minimizes shoot-through current, the outputs of these devices can provide high gate drive current where it is most needed at the Miller plateau region during the MOSFET switching transition. A unique hybrid-output stage paralleling bipolar and MOSFET transistors (TrueDrive) allows efficient current delivery at low supply voltages. With this drive architecture, UCC2732x-Q1 can be used in industry standard 6-A, 9-A, and many 12-A driver applications. Latch-up and ESD protection circuits are also included. Finally, the UCC2732x-Q1 provides an enable (ENBL) function to better control the operation of the driver applications. ENBL is implemented on pin 3, which was previously left unused in the industry-standard pinout. It is internally pulled up to VDD for active-high logic and can be left open for standard operation.
In addition to 8-pin SOIC (D) package offerings, the UCC2732x-Q1 also comes in the thermally enhanced but tiny 8-pin MSOP-PowerPAD (DGN) package. The PowerPAD package drastically lowers the thermal resistance to extend the temperature operation range and improve long-term reliability.
- Qualified for Automotive Applications
- AEC-Q100 Qualified With the Following Results:
- Device Temperature Grade 1: 40°C to 125°C Ambient Operating Temperature Range
- Device HBM ESD Classification Level 2
- Device CDM ESD Classification Level C6
- Industry-Standard Pinout With Addition of Enable Function
- High Peak-Current Drive Capability of ±9 A at the Miller Plateau Region Using TrueDrive Technology
- Efficient Constant-Current Sourcing Using a Unique Bipolar and CMOS Output Stage
- TTL and CMOS-Compatible Inputs Independent of Supply Voltage
- 20-ns Typical Rise and 15-ns Typical Fall Times With 10-nF Load
- Typical Propagation Delay Times of 25 ns With Input Falling and 35 ns With Input Rising
- 4-V to 15-V Supply Voltage
- Available in Thermally Enhanced MSOP PowerPAD Package
- TrueDrive Output Architecture Using Bipolar and CMOS Transistors in Parallel
- Number of channels (#)
- 1
- Power switch
- MOSFET, IGBT
- Peak output current (A)
- 9
- Input VCC (Min) (V)
- 4
- Input VCC (Max) (V)
- 15
- Features
- Enable Pin
- Operating temperature range (C)
- -40 to 125
- Rise time (ns)
- 20
- Fall time (ns)
- 20
- Prop delay (ns)
- 25
- Input threshold
- CMOS, TTL
- Channel input logic
- Inverting
- Input negative voltage (V)
- 0
- Rating
- Automotive
- Driver configuration
- Single
UCC27321-Q1的完整型号有:UCC27321QDRQ1,以下是这些产品的关键参数及官网采购报价:
UCC27321QDRQ1,工作温度:-40 to 125,封装:SOIC (D)-8,包装数量MPQ:2500个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网UCC27321QDRQ1的批量USD价格:.519(1000+)

UCC27321Q1EVM 具有使能端的 UCC27321-Q1 汽车类单路 9A 高速低侧 MOSFET 驱动器
UCC2732X-Q1 是一系列高速驱动器,能够提供高达 9A 的峰值驱动电流,经优化可适用于因高 dv/dt 转换而需要极端 Miller 电流的系统。借助该 EVM,可实现对所提供两个逻辑选项(反相 (UCC27321-Q1) 和非反相 (UCC27322-Q1))的评估。UCC27322-Q1 提供使能 (ENBL) 功能以更好地控制驱动器应用的操作,为方便起见,已将此功能在 EVM 上进行了细分。此系列的驱动器可用作低功耗控制器(分立式控制器、DSP、MCU 或微控制器)和功率 MOSFET 之间的接口。
UCC27322Q1EVM 具有使能端的 UCC27322-Q1 汽车类单路 9A 高速低侧 MOSFET 驱动器
UCC2732X-Q1 是一系列高速驱动器,能够提供高达 9A 的峰值驱动电流,经优化可适用于因高 dv/dt 转换而需要极端 Miller 电流的系统。借助该 EVM,可实现对所提供两个逻辑选项(反相 (UCC27321-Q1) 和非反相 (UCC27322-Q1))的评估。UCC27321-Q1 提供使能 (ENBL) 功能以更好地控制驱动器应用的操作,为方便起见,已将此功能在 EVM 上进行了细分。此系列的驱动器可用作低功耗控制器(分立式控制器、DSP、MCU 或微控制器)和功率 MOSFET 之间的接口。
UCC27321 PSpice Transient Model
PSpice for TI 可提供帮助评估模拟电路功能的设计和仿真环境。此功能齐全的设计和仿真套件使用 Cadence 的模拟分析引擎。PSpice for TI 可免费使用,包括业内超大的模型库之一,涵盖我们的模拟和电源产品系列以及精选的模拟行为模型。借助PSpice for TI 的设计和仿真环境及其内置的模型库,您可对复杂的混合信号设计进行仿真。创建完整的终端设备设计和原型解决方案,然后再进行布局和制造,可缩短产品上市时间并降低开发成本。
在PSpice for TI 设计和仿真工具中,您可以搜索 TI (...)




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